×
The R860 with a 2U air-cooled form factor and four (4) Intel Xeon® Scalable Processors enables businesses to accelerate a wide variety of core and business-critical applications including databases, analytics, and other data driven applications.
The R860 with a 2U air-cooled form factor and four (4) Intel Xeon® Scalable Processors enables businesses to accelerate a wide variety of core and business-critical applications including databases, analytics, and other data driven applications.
● With a maximum CPU core count of 60 cores and the ability to support 64 DDR5 DIMMs for a total of 16TB of memory, the R860 is large enough to run in-memory databases and multiple applications.
● Scale up business needs with support for up to 24 NVMe drives, DIMMs, 8 PCIe Gen5 slots for I/O expansion, LOM, and industry standard OCP to enable customers flexible network connectivity.
● Enable fast 1:1 CPU-I/O communications with PCIe Gen5 adaptor support.
| Processor | Up to four 4th Generation Intel Xeon Scalable processor with up to 60 cores per processor and with optional Intel® QuickAssist Technology |
| Memory | • 64 DDR5 DIMM slots, supports RDIMM 16 TB max, speeds up to 4800 MT/s |
| • Supports registered ECC DDR5 DIMMs only | |
| Storage controllers | • Internal Controllers: PERC H965i, PERC H755, PERC H355, HBA355i, HBA465i |
| • External Controller: PERC H965e | |
| • Internal Boot:Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB | |
| • External HBA (non-RAID): HBA355e, HBA465e • Software Raid: S160 | |
| Drive Bays | Front bays: |
| • Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) drives max 122.88 TB | |
| • Up to 8 x EDSFF E3.S Gen5 NVMe (SSD) drives max 61.44TB | |
| • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives max 245.76 TB | |
| • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives max 368.34 TB | |
| • Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) drives + 8 x 2.5-inch NVMe (SSD) drives max 368.34 TB Rear bays: | |
| • Up to 2 x2.5-inch SAS/SATA (HDD/SSD) drives max 30.72 TB | |
| • Up to 4 x EDSFF E3.S Gen5 NVMe (SSD) drives max 30.72 TB | |
| Power Supplies | • 1100 W Titanium 100—240 VAC or 240 HVDC, hot swap redundant |
| • 1400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant | |
| •1800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant | |
| • 2400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant | |
| • 2800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant | |
| Cooling Options | • Air cooling |
| • Optional Direct Liquid Cooling (DLC) | |
| Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate. | |
| Fans | • Standard (STD) fans |
| • Up to 6 sets hot plug fans | |
| Dimensions | • Height – 86.8 mm (3.41 inches) |
| • Width – 482 mm (18.97 inches) | |
| • Depth – 883.2 mm (34.77 inches) with bezel 869.2 mm (34.22 inches) without bezel | |
| Form Factor | 2U rack server |
| Embedded Management | • iDRAC9 |
| • iDRAC Direct | |
| • iDRAC RESTful API with Redfish | |
| • iDRAC Service Module | |
| • Quick Sync 2 wireless module | |
| Bezel | Optional LCD bezel or security bezel |
| OpenManage Software | • CloudIQ for PowerEdge plug in |
| • OpenManage Enterprise | |
| • OpenManage Enterprise Integration for VMware vCenter | |
| • OpenManage Integration for Microsoft System Center | |
| • OpenManage Integration with Windows Admin Center | |
| • OpenManage Power Manager plugin | |
| •OpenManage Service plugin | |
| • OpenManage Update Manager plugin | |
| Mobility | OpenManage Mobile |
| OpenManage Integrations | • BMC Truesight |
| • Microsoft System Center | |
| • OpenManage Integration with ServiceNow | |
| • Red Hat Ansible Modules | |
| • Terraform Providers | |
| • VMware vCenter and vRealize Operations Manager | |
| Security | • Cryptographically signed firmware |
| • Data at Rest Encryption (SEDs with local or external key mgmt) | |
| • Secure Boot | |
| • Secured Component Verification (Hardware integrity check) | |
| • Secure Erase | |
| • Silicon Root of Trust | |
| • System Lockdown (requires iDRAC9 Enterprise or Datacenter) | |
| • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ | |
| Embedded NIC | 2 x 1 GbE LOM card (optional) |
| Network Options | 1 x OCP card 3.0 (optional) |
| Note: The system allows either LOM card or an OCP card or both to be installed in the system. | |
| Ports | Front Ports • 1 x iDRAC Direct (Micro-AB USB) port • 1 x USB 2.0 • 1 x VGA |
| Rear Ports • 1 x Dedicated iDRAC ethernet port • 1 x USB 3.0 • 1 x USB 2.0 • 1 x Serial (optional) • 1 x VGA (optional for Direct Liquid Cooling configuration) | |
| Internal Ports • 1 x USB 3.0 (optional) | |
| PCIe | Up to eight PCIe slots: |
| • Slot 1: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length | |
| • Slot 2: 1 x16 Gen5 or 1 x8 Gen4 Full height,Half length | |
| • Slot 3: 1 x16 Gen5 Low profile, Half length | |
| • Slot 4: 1 x16 Gen5 Full height, Half length | |
| • Slot 5: 1 x16 Gen5 Full height, Half length | |
| • Slot 6: 1 x16 Gen5 Low profile, Half length | |
| • Slot 7: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length | |
| •Slot 8: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length | |
| Operating System and Hypervisors | • Canonical Ubuntu Server LTS |
| • Microsoft Windows Server with Hyper-V | |
| • Red Hat Enterprise Linux | |
| • SUSE Linux Enterprise Server | |
| • VMware ESXi |
EN
